Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Aina ya Kiunganishi | Plug |
Aina ya Mawasiliano | Male Pin |
Lami - Kuoana | 0.050" (1.27mm) |
Idadi ya Nafasi | 100 |
Idadi ya Safu | 2 |
Nafasi ya Mstari - Kuoana | 0.100" (2.54mm) |
Idadi ya Nafasi zilizopakiwa | All |
Mtindo | Board to Board |
Kufunika | Shrouded - 4 Wall |
Aina ya Kuweka | Through Hole |
Kukomesha | Solder |
Aina ya Kufunga | Push-Pull |
Urefu wa Mawasiliano - Kuoana | - |
Urefu wa Mawasiliano - Chapisha | 0.095" (2.41mm) |
Urefu wa Mawasiliano ya Jumla | - |
Urefu wa Insulation | 0.340" (8.64mm) |
Wasiliana na Sura | Square |
Wasiliana Kumaliza - Kuchumbiana | Gold |
Wasiliana Kumaliza Unene - Kupandana | 30.0µin (0.76µm) |
Wasiliana kumaliza - Tuma | Tin-Lead |
Nyenzo ya Mawasiliano | Phosphor Bronze |
Nyenzo ya kuhami | Thermoplastic |
Vipengele | Ground Bus (Plane) |
Joto la Uendeshaji | -65°C ~ 125°C |
Ulinzi wa Ingress | - |
Ukadiriaji wa kuwaka kwa nyenzo | - |
Rangi ya Insulation | Natural |
Ukadiriaji wa sasa | Varies by Wire Gauge |
Ukadiriaji wa Voltage | 30VAC |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |