| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | BGA |
| Idadi ya Vyeo au Pini (Gridi) | 520 (31 x 31) |
| Lami - Kuoana | 0.050" (1.27mm) |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 10.0µin (0.25µm) |
| Nyenzo ya Mawasiliano - Kuchumbiana | Beryllium Copper |
| Aina ya Kuweka | Through Hole |
| Vipengele | Closed Frame |
| Kukomesha | Solder |
| Panda - Chapisha | 0.050" (1.27mm) |
| Wasiliana kumaliza - Tuma | Gold |
| Wasiliana Kumaliza Unene - Tuma | 10.0µin (0.25µm) |
| Nyenzo ya Mawasiliano - Chapisha | Brass |
| Nyenzo ya Nyumba | FR4 Epoxy Glass |
| Joto la Uendeshaji | -55°C ~ 125°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
