Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Andika | Film Over Foam |
Sura | Rectangle |
Upana | 0.236" (6.00mm) |
Urefu | 0.276" (7.00mm) |
Urefu | 0.315" (8.00mm) |
Nyenzo | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
Mchovyo | - |
Kupaka - Unene | - |
Njia ya Kiambatisho | Solder |
Joto la Uendeshaji | -40°C ~ 70°C |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |