| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi | 48 |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Board |
| Kufunika | Shrouded - 4 Wall |
| Aina ya Kuweka | Through Hole |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Urefu wa Mawasiliano - Kuoana | 0.275" (6.99mm) |
| Urefu wa Mawasiliano - Chapisha | 0.103" (2.62mm) |
| Urefu wa Mawasiliano ya Jumla | 0.555" (14.10mm) |
| Urefu wa Insulation | 0.500" (12.70mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Gold or Gold, GXT™ |
| Wasiliana Kumaliza Unene - Kupandana | 30.0µin (0.76µm) |
| Wasiliana kumaliza - Tuma | - |
| Nyenzo ya Mawasiliano | Phosphor Bronze |
| Nyenzo ya kuhami | Liquid Crystal Polymer (LCP), Glass Filled |
| Vipengele | - |
| Joto la Uendeshaji | - |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
