Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Andika | QFP |
Idadi ya Vyeo au Pini (Gridi) | 132 (4 x 33) |
Lami - Kuoana | 0.050" (1.27mm) |
Wasiliana Kumaliza - Kuchumbiana | Tin-Lead |
Wasiliana Kumaliza Unene - Kupandana | 200.0µin (5.08µm) |
Nyenzo ya Mawasiliano - Kuchumbiana | Phosphor Bronze |
Aina ya Kuweka | Through Hole |
Vipengele | Closed Frame |
Kukomesha | Solder |
Panda - Chapisha | 0.050" (1.27mm) |
Wasiliana kumaliza - Tuma | Tin-Lead |
Wasiliana Kumaliza Unene - Tuma | 200.0µin (5.08µm) |
Nyenzo ya Mawasiliano - Chapisha | Phosphor Bronze |
Nyenzo ya Nyumba | Liquid Crystal Polymer (LCP) |
Joto la Uendeshaji | - |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |