| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kumbukumbu | Non-Volatile |
| Muundo wa Kumbukumbu | EEPROM |
| Teknolojia | EEPROM |
| Ukubwa wa Kumbukumbu | 4Kb (512 x 8, 256 x 16) |
| Mzunguko wa Saa | 3MHz |
| Andika Wakati wa Mzunguko - Neno, Ukurasa | 6ms |
| Muda wa Ufikiaji | - |
| Kiolesura cha Kumbukumbu | SPI |
| Voltage - Ugavi | 2.5V ~ 5.5V |
| Joto la Uendeshaji | -40°C ~ 85°C (TA) |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 8-SOIC (0.154", 3.90mm Width) |
| Kifurushi cha Kifaa cha muuzaji | 8-SOIC |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
