| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header, Breakaway |
| Aina ya Mawasiliano | Male Pin |
| Lami - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi | 10 |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.100" (2.54mm) |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Board or Cable |
| Kufunika | Unshrouded |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Urefu wa Mawasiliano - Kuoana | 0.228" (5.80mm) |
| Urefu wa Mawasiliano - Chapisha | - |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.110" (2.79mm) |
| Wasiliana na Sura | Square |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 3.90µin (0.099µm) |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Phosphor Bronze |
| Nyenzo ya kuhami | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| Vipengele | - |
| Joto la Uendeshaji | - |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | - |
| Rangi ya Insulation | - |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
