| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Teknolojia | Magnetic Coupling |
| Andika | SPI |
| Nguvu iliyotengwa | No |
| Idadi ya Vituo | 4 |
| Pembejeo - Upande 1 / Upande 2 | 2/2 |
| Aina ya Kituo | Unidirectional |
| Voltage - Kutengwa | 3000Vrms |
| Njia ya kawaida Kinga ya muda mfupi (Min) | 100kV/µs |
| Kiwango cha Takwimu | 150Mbps |
| Ucheleweshaji wa uenezi tpLH / tpHL (Max) | 13ns, 13ns |
| Upanaji wa Upana wa Pulse (Upeo) | 3ns |
| Wakati wa Kuinuka / Kuanguka (Aina) | 2.5ns, 2.5ns |
| Voltage - Ugavi | 1.8V ~ 5.5V |
| Joto la Uendeshaji | -40°C ~ 125°C |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 16-SOIC (0.295", 7.50mm Width) |
| Kifurushi cha Kifaa cha muuzaji | 16-SOIC |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
