| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kumbukumbu | Non-Volatile |
| Muundo wa Kumbukumbu | EEPROM |
| Teknolojia | EEPROM |
| Ukubwa wa Kumbukumbu | 1Mb (128K x 8) |
| Mzunguko wa Saa | - |
| Andika Wakati wa Mzunguko - Neno, Ukurasa | 10ms |
| Muda wa Ufikiaji | 150ns |
| Kiolesura cha Kumbukumbu | Parallel |
| Voltage - Ugavi | 4.5V ~ 5.5V |
| Joto la Uendeshaji | -55°C ~ 125°C (TC) |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 32-CFlatpack |
| Kifurushi cha Kifaa cha muuzaji | 32-Flatpack, Ceramic Bottom-Brazed |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
