| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Msingi | ELP |
| Sababu ya Ushawishi (Al) | - |
| Uvumilivu | - |
| Pengo | PC200 |
| Uwezeshaji Ufanisi (µe) | - |
| Upenyezaji wa Awali (µi) | - |
| Nyenzo | - |
| Sababu ya Msingi (ΣI / A) mm 1 | - |
| Urefu wa Ufanisi (le) mm | - |
| Eneo La Ufanisi (Ae) mm² | - |
| Kiwango cha chini cha Msalaba Msingi (Amin) mm² | - |
| Kiasi kinachofaa cha Magnetic (Ve) mm³ | - |
| Maliza | - |
| Kifurushi cha Kifaa cha muuzaji | - |
| Urefu | Uncoated |
| Urefu | 0.157" (4.00mm) |
| Upana | 0.709" (18.00mm) |
| Kipenyo | 0.394" (10.00mm) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
