| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Msingi | ELP |
| Sababu ya Ushawishi (Al) | 2100nH |
| Uvumilivu | ±25% |
| Pengo | PC200 |
| Uwezeshaji Ufanisi (µe) | - |
| Upenyezaji wa Awali (µi) | ELP 22 x 6 x 16 |
| Nyenzo | Ungapped |
| Sababu ya Msingi (ΣI / A) mm 1 | 640 |
| Urefu wa Ufanisi (le) mm | 800 |
| Eneo La Ufanisi (Ae) mm² | 0.41 |
| Kiwango cha chini cha Msalaba Msingi (Amin) mm² | 32.5 |
| Kiasi kinachofaa cha Magnetic (Ve) mm³ | 78.3 |
| Maliza | 77.9 |
| Kifurushi cha Kifaa cha muuzaji | 2540 |
| Urefu | Uncoated |
| Urefu | 5.70mm |
| Upana | 21.80mm |
| Kipenyo | 15.80mm |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
