| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Upinzani katika Ohms @ 25 ° C | 100 |
| Uvumilivu wa Upinzani | ±10% |
| B Thamani Uvumilivu | - |
| B0 / 50 | 2941K |
| B25 / 50 | - |
| B25 / 75 | - |
| B25 / 85 | - |
| B25 / 100 | - |
| Joto la Uendeshaji | 150°C |
| Nguvu - Max | - |
| Urefu - Waya wa kuongoza | - |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | Nonstandard Chip |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
