| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Outer Shroud Contact |
| Lami - Kuoana | - |
| Idadi ya Nafasi | 4 (2 + 2 Power) |
| Idadi ya Safu | - |
| Nafasi ya Mstari - Kuoana | - |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Board |
| Kufunika | Shrouded - 4 Wall |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Aina ya Kufunga | Friction Lock |
| Urefu wa Mawasiliano - Kuoana | - |
| Urefu wa Mawasiliano - Chapisha | - |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.030" (0.75mm) |
| Wasiliana na Sura | - |
| Wasiliana Kumaliza - Kuchumbiana | Gold |
| Wasiliana Kumaliza Unene - Kupandana | 2.00µin (0.051µm) |
| Wasiliana kumaliza - Tuma | Gold |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Nyenzo ya kuhami | Liquid Crystal Polymer (LCP) |
| Vipengele | - |
| Joto la Uendeshaji | -35°C ~ 85°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 V-0 |
| Rangi ya Insulation | Black |
| Ukadiriaji wa sasa | - |
| Ukadiriaji wa Voltage | 50V |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
