| Andika | Maelezo. |
| Hali ya Sehemu | Obsolete |
|---|---|
| Kikundi cha Masafa | - |
| Mzunguko (Katikati / Bendi) | - |
| Mzunguko wa Mzunguko | - |
| Aina ya Antena | Chip |
| Idadi ya Bendi | 1 |
| VSWR | 2 |
| Kurudisha Hasara | - |
| Faida | 3dBi |
| Nguvu - Max | - |
| Vipengele | - |
| Kukomesha | Solder |
| Ulinzi wa Ingress | - |
| Aina ya Kuweka | Surface Mount |
| Urefu (Max) | 0.098" (2.50mm) |
| Maombi | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
