Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Kidokezo - Aina | Soldering |
Kidokezo - Sura | Screwdriver |
Urefu | - |
Upana | 0.062" (1.57mm) |
Urefu | 1.156" (29.36mm) |
Kipenyo | - |
Kidokezo - Ukubwa wa Chip | - |
Kiwango cha joto | 700°F (371°C) |
Kwa Matumizi na / Bidhaa Zinazohusiana | W60P, WLC100 |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |