Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Mtindo wa Kiunganishi | Receptacle |
Aina ya Kiunganishi | Serial I/O |
Idadi ya Nafasi | 20 |
Aina ya Kuweka | Surface Mount, Through Hole |
Kukomesha | Solder |
Vipengele | Board Guide |
Wasiliana kumaliza | Gold |
Wasiliana Kumaliza Unene | 11.8µin (0.30µm) |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |