| Andika | Maelezo. |
| Hali ya Sehemu | Not For New Designs |
|---|---|
| Kazi | TDM-over-Packet (TDMoP) |
| Kiolesura | TDMoP |
| Idadi ya Mizunguko | 1 |
| Voltage - Ugavi | 1.8V, 3.3V |
| Ugavi wa Sasa | - |
| Nguvu (Watts) | - |
| Joto la Uendeshaji | -40°C ~ 85°C |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 676-BGA |
| Kifurushi cha Kifaa cha muuzaji | 676-TEPBGA (27x27) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
