Andika | Maelezo. |
Hali ya Sehemu | Not For New Designs |
---|---|
Kazi | TDM-over-Packet (TDMoP) |
Kiolesura | TDMoP |
Idadi ya Mizunguko | 1 |
Voltage - Ugavi | 1.8V, 3.3V |
Ugavi wa Sasa | - |
Nguvu (Watts) | - |
Joto la Uendeshaji | -40°C ~ 85°C |
Aina ya Kuweka | Surface Mount |
Kifurushi / Kesi | 676-BGA |
Kifurushi cha Kifaa cha muuzaji | 676-TEPBGA (27x27) |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |