| Andika | Maelezo. |
| Hali ya Sehemu | Discontinued at Digi-Key |
|---|---|
| Kidokezo - Aina | Soldering |
| Kidokezo - Sura | Hoof, Dent |
| Urefu | - |
| Upana | - |
| Urefu | - |
| Kipenyo | - |
| Kidokezo - Ukubwa wa Chip | - |
| Kiwango cha joto | 778°F ~ 887°F (420°C ~ 475°C) |
| Kwa Matumizi na / Bidhaa Zinazohusiana | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
