| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Low Pass |
| Chuja Agizo | 3rd |
| Teknolojia | RLC |
| Idadi ya Vituo | 6 |
| Mzunguko wa Kituo / Cutoff | - |
| Thamani ya Upunguzaji | - |
| Upinzani - Kituo (Ohms) | 1 |
| Sasa | - |
| Maadili | L = 1nH, C = 2.5pF |
| Ulinzi wa ESD | Yes |
| Joto la Uendeshaji | -30°C ~ 85°C |
| Maombi | Data Lines for Mobile Devices |
| Voltage - Imepimwa | - |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 17-WFBGA, FCBGA |
| Ukubwa / Kipimo | 0.094" L x 0.043" W (2.40mm x 1.10mm) |
| Urefu | 0.026" (0.65mm) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
