Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Aina ya Kit | Ceramic, Tantalum |
Uwezo wa Uwezo | 1500pF ~ 220µF |
Aina ya Kuweka | Surface Mount, Through Hole |
Voltage - Imepimwa | 10 ~ 500 V |
Uvumilivu | ±2.5%, ±5%, ±10% |
Maombi | Boardflex Sensitive, Downhole, General Purpose |
Vipengele | Low ESL, High Voltage, High Temperature, Soft Termination |
Wingi | 200 Pieces (Assorted Per Value) |
Vifurushi vilivyojumuishwa | 0402 ~ 2917 (1005 ~ 7343 Metric), Radial |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |