| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | DIP, 0.3" (7.62mm) Row Spacing |
| Idadi ya Vyeo au Pini (Gridi) | 18 (2 x 9) |
| Lami - Kuoana | 0.100" (2.54mm) |
| Wasiliana Kumaliza - Kuchumbiana | Tin |
| Wasiliana Kumaliza Unene - Kupandana | - |
| Nyenzo ya Mawasiliano - Kuchumbiana | Beryllium Copper |
| Aina ya Kuweka | Surface Mount |
| Vipengele | Open Frame |
| Kukomesha | Solder |
| Panda - Chapisha | 0.100" (2.54mm) |
| Wasiliana kumaliza - Tuma | Tin |
| Wasiliana Kumaliza Unene - Tuma | - |
| Nyenzo ya Mawasiliano - Chapisha | Beryllium Copper |
| Nyenzo ya Nyumba | Liquid Crystal Polymer (LCP) |
| Joto la Uendeshaji | -55°C ~ 125°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
