| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Receptacle |
| Aina ya Mawasiliano | Forked |
| Mtindo | Board to Board |
| Idadi ya Nafasi | 8 |
| Idadi ya Nafasi zilizopakiwa | All |
| Lami - Kuoana | 0.031" (0.80mm) |
| Idadi ya Safu | 2 |
| Nafasi ya Mstari - Kuoana | 0.059" (1.50mm) |
| Aina ya Kuweka | Surface Mount |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Wasiliana Kumaliza - Kuchumbiana | Tin |
| Wasiliana Kumaliza Unene - Kupandana | - |
| Rangi ya Insulation | Black |
| Urefu wa Insulation | 0.128" (3.25mm) |
| Urefu wa Mawasiliano - Chapisha | - |
| Joto la Uendeshaji | -40°C ~ 85°C |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 V-0 |
| Wasiliana kumaliza - Tuma | - |
| Urefu wa Kupandana kwa Mated | 4.5mm |
| Ulinzi wa Ingress | - |
| Vipengele | Solder Retention |
| Ukadiriaji wa sasa | 0.5A |
| Ukadiriaji wa Voltage | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
