| Andika | Maelezo. |
| Hali ya Sehemu | Preliminary |
|---|---|
| Aina ya Kumbukumbu | Volatile |
| Muundo wa Kumbukumbu | DRAM |
| Teknolojia | SDRAM - Mobile |
| Ukubwa wa Kumbukumbu | 32Mb (2M x 16) |
| Mzunguko wa Saa | 133MHz |
| Andika Wakati wa Mzunguko - Neno, Ukurasa | - |
| Muda wa Ufikiaji | 6ns |
| Kiolesura cha Kumbukumbu | Parallel |
| Voltage - Ugavi | 3V ~ 3.6V |
| Joto la Uendeshaji | -40°C ~ 85°C (TA) |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 54-TFBGA |
| Kifurushi cha Kifaa cha muuzaji | 54-TFBGA (8x8) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
