| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kumbukumbu | Volatile |
| Muundo wa Kumbukumbu | DRAM |
| Teknolojia | SDRAM - DDR3L |
| Ukubwa wa Kumbukumbu | 2Gb (256M x 8) |
| Mzunguko wa Saa | 667MHz |
| Andika Wakati wa Mzunguko - Neno, Ukurasa | 15ns |
| Muda wa Ufikiaji | 20ns |
| Kiolesura cha Kumbukumbu | Parallel |
| Voltage - Ugavi | 1.283V ~ 1.45V |
| Joto la Uendeshaji | 0°C ~ 95°C (TC) |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 78-TFBGA |
| Kifurushi cha Kifaa cha muuzaji | 78-TWBGA (8x10.5) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
