Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Aina ya Kiunganishi | Receptacle, Outer Shroud Contacts |
Idadi ya Nafasi | 25 |
Panda | 0.039" (1.00mm) |
Idadi ya Safu | 2 |
Aina ya Kuweka | Surface Mount |
Vipengele | Board Guide, Solder Retention |
Wasiliana kumaliza | Tin |
Wasiliana Kumaliza Unene | 80.0µin (2.03µm) |
Urefu wa Kupandana kwa Mated | 4.3mm |
Urefu Juu ya Bodi | 0.130" (3.30mm) |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |