| Andika | Maelezo. |
| Hali ya Sehemu | Last Time Buy |
|---|---|
| Aina ya Kituo | Through Board, Locking |
| Kipenyo cha Shimo | - |
| Kipenyo cha Insulation | 0.059" ~ 0.087" (1.50mm ~ 2.21mm) |
| Urefu - Kwa ujumla | 0.370" (9.40mm) |
| Kupima waya | 18-22 AWG |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
