| Andika | Maelezo. |
| Hali ya Sehemu | Not For New Designs |
|---|---|
| Kidokezo - Aina | Soldering |
| Kidokezo - Sura | Conical |
| Urefu | - |
| Upana | - |
| Urefu | 0.500" (12.70mm) |
| Kipenyo | 0.059" (1.50mm) OD |
| Kidokezo - Ukubwa wa Chip | - |
| Kiwango cha joto | 750°F ~ 900°F (400°C ~ 482°C) |
| Kwa Matumizi na / Bidhaa Zinazohusiana | ML500MP |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |