| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kumbukumbu | Volatile |
| Muundo wa Kumbukumbu | DRAM |
| Teknolojia | DRAM |
| Ukubwa wa Kumbukumbu | 16Mb (1M x 16) |
| Mzunguko wa Saa | - |
| Andika Wakati wa Mzunguko - Neno, Ukurasa | - |
| Muda wa Ufikiaji | 30ns |
| Kiolesura cha Kumbukumbu | Parallel |
| Voltage - Ugavi | 4.5V ~ 5.5V |
| Joto la Uendeshaji | 0°C ~ 70°C (TA) |
| Aina ya Kuweka | Surface Mount |
| Kifurushi / Kesi | 50-TSOP (0.400", 10.16mm Width) |
| Kifurushi cha Kifaa cha muuzaji | 50-TSOP II |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
