| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Kidokezo - Aina | Soldering |
| Kidokezo - Sura | Chisel |
| Urefu | - |
| Upana | - |
| Urefu | 0.333" (8.45mm) |
| Kipenyo | 0.010" (0.25mm) OD |
| Kidokezo - Ukubwa wa Chip | - |
| Kiwango cha joto | - |
| Kwa Matumizi na / Bidhaa Zinazohusiana | WMP |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
