| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kit | Adapter, Breakout Boards |
| Wingi | 23 Pieces (4 Values - Mixed Quantities) |
| Kifurushi Kimekubaliwa | QSOP, TSSOP28, XFBGA, XQFN |
| Ufafanuzi | SMD to DIP |
| Idadi ya Nafasi | 16, 28 |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
