Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Badilisha kutoka (Adapter End) | SOIC |
Badilisha hadi (Mwisho wa Adapter) | DIP, 0.6" (15.24mm) Row Spacing |
Idadi ya Pini | 40 |
Lami - Kuoana | 0.050" (1.27mm) |
Wasiliana Kumaliza - Kuchumbiana | - |
Aina ya Kuweka | Through Hole |
Kukomesha | Solder |
Panda - Chapisha | 0.100" (2.54mm) |
Wasiliana kumaliza - Tuma | - |
Nyenzo ya Nyumba | - |
Nyenzo za Bodi | - |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |