| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Bodi ya Proto | SMD to DIP |
| Kifurushi Kimekubaliwa | CSP, TCSP, UCSP |
| Idadi ya Nafasi | 20 |
| Panda | 0.020" (0.50mm) |
| Unene wa Bodi | 0.062" (1.57mm) 1/16" |
| Nyenzo | FR4 Epoxy Glass |
| Ukubwa / Kipimo | 0.700" x 1.000" (17.78mm x 25.40mm) |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
