Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Kidokezo - Aina | Soldering |
Kidokezo - Sura | Pencil |
Urefu | - |
Upana | 0.010" (0.25mm) |
Urefu | 0.850" (21.59mm) |
Kipenyo | - |
Kidokezo - Ukubwa wa Chip | - |
Kiwango cha joto | - |
Kwa Matumizi na / Bidhaa Zinazohusiana | Modular Heaters |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |