| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Kidokezo - Aina | Soldering |
| Kidokezo - Sura | Sloped |
| Urefu | - |
| Upana | - |
| Urefu | 0.457" (11.60mm) |
| Kipenyo | 0.031" (0.80mm) OD |
| Kidokezo - Ukubwa wa Chip | - |
| Kiwango cha joto | 850°F (450°C) |
| Kwa Matumizi na / Bidhaa Zinazohusiana | P2C, P2KC |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
