Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Mtindo wa Kiunganishi | PSMP |
Aina ya Kiunganishi | Jack, Male Pin |
Kukomesha Mawasiliano | Solder |
Kukomesha Ngao | Solder |
Impedance | 50 Ohm |
Aina ya Kuweka | Surface Mount, Through Hole |
Kuweka Kipengele | - |
Kundi la Cable | - |
Aina ya Kufunga | Snap-On |
Mzunguko - Max | 10GHz |
Idadi ya Bandari | 1 |
Vipengele | Smooth Bore |
Rangi ya Makazi | Gold |
Ulinzi wa Ingress | - |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |