Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Kidokezo - Aina | Soldering |
Kidokezo - Sura | Flat, Single |
Urefu | 0.031" (0.80mm) |
Upana | 0.125" (3.18mm) |
Urefu | 0.620" (15.75mm) |
Kipenyo | - |
Kidokezo - Ukubwa wa Chip | - |
Kiwango cha joto | 700°F (371°C) |
Kwa Matumizi na / Bidhaa Zinazohusiana | TC201, TCP |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |