| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Shield Finger |
| Sura | - |
| Upana | 0.114" (2.90mm) |
| Urefu | 0.274" (6.95mm) |
| Urefu | 0.219" (5.57mm) |
| Nyenzo | Copper Alloy |
| Mchovyo | Tin |
| Kupaka - Unene | 94.49µin (2.40µm) |
| Njia ya Kiambatisho | Solder |
| Joto la Uendeshaji | -55°C ~ 125°C |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
