| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kit | Digital Isolator |
| Wingi | - |
| Yaliyomo ya Kit | Si8261ACC-C-IP, Si8261BCC-C-IP, Si8261ACC-C-IS, Si8261BCC-C-IS, Si8261ACD-C-IS, Si8261BCD-C-IS |
| Aina ya Kuweka | Surface Mount, Through Hole |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
