| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kiunganishi | Header |
| Aina ya Mawasiliano | Outer Shroud Contact |
| Lami - Kuoana | 0.031" (0.80mm) |
| Idadi ya Nafasi | 4 |
| Idadi ya Safu | 1 |
| Nafasi ya Mstari - Kuoana | - |
| Idadi ya Nafasi zilizopakiwa | All |
| Mtindo | Board to Cable/Wire |
| Kufunika | Shrouded - 4 Wall |
| Aina ya Kuweka | Surface Mount, Right Angle |
| Kukomesha | Solder |
| Aina ya Kufunga | Push-Pull |
| Urefu wa Mawasiliano - Kuoana | - |
| Urefu wa Mawasiliano - Chapisha | - |
| Urefu wa Mawasiliano ya Jumla | - |
| Urefu wa Insulation | 0.069" (1.75mm) |
| Wasiliana na Sura | Rectangular |
| Wasiliana Kumaliza - Kuchumbiana | Tin |
| Wasiliana Kumaliza Unene - Kupandana | - |
| Wasiliana kumaliza - Tuma | Tin |
| Nyenzo ya Mawasiliano | Copper Alloy |
| Nyenzo ya kuhami | Polyamide (PA), Nylon |
| Vipengele | Solder Retention |
| Joto la Uendeshaji | -25°C ~ 85°C |
| Ulinzi wa Ingress | - |
| Ukadiriaji wa kuwaka kwa nyenzo | UL94 V-0 |
| Rangi ya Insulation | Natural |
| Ukadiriaji wa sasa | 0.2A, 0.5A |
| Ukadiriaji wa Voltage | 30V |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
