| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Wire Solder |
| Muundo | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Kipenyo | 0.020" (0.51mm) |
| Kiwango cha kuyeyuka | 423 ~ 428°F (217 ~ 220°C) |
| Aina ya Flux | No-Clean |
| Kupima waya | 24 AWG, 25 SWG |
| Mchakato | Lead Free |
| Fomu | Spool, 1 oz (28.35g) |
| Maisha ya rafu | - |
| Anza maisha ya rafu | - |
| Uhifadhi / Jokofu Joto | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
