| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Mtindo wa Kiunganishi | SMP |
| Aina ya Kiunganishi | Jack, Male Pin |
| Kukomesha Mawasiliano | Solder |
| Kukomesha Ngao | Solder |
| Impedance | 50 Ohm |
| Aina ya Kuweka | Surface Mount |
| Kuweka Kipengele | - |
| Kundi la Cable | - |
| Aina ya Kufunga | Snap-On |
| Mzunguko - Max | 18GHz |
| Idadi ya Bandari | 1 |
| Vipengele | Smooth Bore |
| Rangi ya Makazi | Gold |
| Ulinzi wa Ingress | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
