| Andika | Maelezo. |
| Hali ya Sehemu | Not For New Designs |
|---|---|
| Kidokezo - Aina | Soldering |
| Kidokezo - Sura | Chisel, Bent |
| Urefu | 0.031" (0.80mm) |
| Upana | 0.063" (1.60mm) |
| Urefu | - |
| Kipenyo | - |
| Kidokezo - Ukubwa wa Chip | - |
| Kiwango cha joto | 698°F (370°C) |
| Kwa Matumizi na / Bidhaa Zinazohusiana | W 61 |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
