Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Mtindo wa Kiunganishi | Receptacle |
Aina ya Kiunganishi | Micro Flyover |
Idadi ya Nafasi | 10 |
Aina ya Kuweka | Surface Mount, Through Hole |
Kukomesha | Solder |
Vipengele | Board Guide |
Wasiliana kumaliza | Gold |
Wasiliana Kumaliza Unene | 30.0µin (0.76µm) |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |