| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Kidokezo - Aina | Rework (Hot Air) |
| Kidokezo - Sura | Nozzle |
| Urefu | - |
| Upana | 0.193" (4.91mm) |
| Urefu | 0.240" (6.10mm) |
| Kipenyo | - |
| Kidokezo - Ukubwa wa Chip | - |
| Kiwango cha joto | 482°F ~ 932°F (250°C ~ 500°C) |
| Kwa Matumizi na / Bidhaa Zinazohusiana | WPA2, WSTA3 |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
