| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Kidokezo - Aina | Soldering |
| Kidokezo - Sura | Spade 35° |
| Urefu | - |
| Upana | 0.079" (2.00mm) |
| Urefu | 0.650" (16.50mm) |
| Kipenyo | - |
| Kidokezo - Ukubwa wa Chip | - |
| Kiwango cha joto | 392°F ~ 932°F (200°C ~ 500°C) |
| Kwa Matumizi na / Bidhaa Zinazohusiana | WSTA6 |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
