Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: No-Clean, Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 565 ~ 574°F (296 ~ 301°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn95Sb5 (95/5), Kipenyo: 0.025" (0.64mm), Kiwango cha kuyeyuka: 450 ~ 464°F (232 ~ 240°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 22 AWG, 23 SWG,
Andika: Wire Solder, Muundo: Sn95Sb5 (95/5), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 450 ~ 464°F (232 ~ 240°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn96.3Ag3.7 (96.3/3.7), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 430 ~ 444°F (221 ~ 223°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn95Sb5 (95/5), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 450 ~ 464°F (232 ~ 240°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn96.3Ag3.7 (96.3/3.7), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 430 ~ 444°F (221 ~ 223°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn95Sb5 (95/5), Kipenyo: 0.050" (1.27mm), Kiwango cha kuyeyuka: 450 ~ 464°F (232 ~ 240°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 16 AWG, 18 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.025" (0.64mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 22 AWG, 23 SWG,
Andika: Wire Solder, Muundo: Sn96.3Ag3.7 (96.3/3.7), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 430 ~ 444°F (221 ~ 223°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn95Ag5 (95/5), Kipenyo: 0.040" (1.02mm), Kiwango cha kuyeyuka: 430 ~ 473°F (221 ~ 245°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 18 AWG, 19 SWG,
Andika: Wire Solder, Muundo: Pb88Sn10Ag2 (88/10/2), Kipenyo: 0.040" (1.02mm), Kiwango cha kuyeyuka: 514 ~ 570°F (268 ~ 299°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 18 AWG, 19 SWG,
Andika: Wire Solder, Muundo: Sn95Sb5 (95/5), Kipenyo: 0.062" (1.57mm), Kiwango cha kuyeyuka: 450 ~ 464°F (232 ~ 240°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 14 AWG, 16 SWG,
Andika: Wire Solder, Muundo: Sn96.3Ag3.7 (96.3/3.7), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 430 ~ 444°F (221 ~ 223°C), Aina ya Flux: No-Clean, Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Kipenyo: 0.063" (1.60mm), Kiwango cha kuyeyuka: 565 ~ 574°F (296 ~ 301°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 14 AWG, 16 SWG,
Andika: Wire Solder, Muundo: Sn96.3Ag3.7 (96.3/3.7), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 430 ~ 444°F (221 ~ 223°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn63Pb36.65Sb0.35 (63/36.65/0.35), Kipenyo: 0.020" (0.51mm), Aina ya Flux: Rosin Activated (RA), Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn95Ag5 (95/5), Kipenyo: 0.031" (0.79mm), Kiwango cha kuyeyuka: 430 ~ 473°F (221 ~ 245°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 20 AWG, 22 SWG,
Andika: Wire Solder, Muundo: Sn96.3Ag3.7 (96.3/3.7), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 430 ~ 444°F (221 ~ 223°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn62Pb36Ag2 (62/36/2), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 354°F (179°C), Aina ya Flux: No-Clean, Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn95Ag5 (95/5), Kipenyo: 0.062" (1.57mm), Kiwango cha kuyeyuka: 430 ~ 473°F (221 ~ 245°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 14 AWG, 16 SWG,
Andika: Wire Solder, Muundo: Sn63Pb37 (63/37), Kipenyo: 0.062" (1.57mm), Kiwango cha kuyeyuka: 361°F (183°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 14 AWG, 16 SWG,
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.015" (0.38mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: Rosin Activated (RA), Kupima waya: 27 AWG, 28 SWG,
Andika: Wire Solder, Muundo: Sn96.5Ag3.5 (96.5/3.5), Kipenyo: 0.020" (0.51mm), Kiwango cha kuyeyuka: 430°F (221°C), Aina ya Flux: No-Clean, Kupima waya: 24 AWG, 25 SWG,
Andika: Wire Solder, Muundo: Sn96.3Ag3.7 (96.3/3.7), Kipenyo: 0.025" (0.64mm), Kiwango cha kuyeyuka: 430 ~ 444°F (221 ~ 223°C), Aina ya Flux: Rosin Mildly Activated (RMA), Kupima waya: 22 AWG, 23 SWG,
Andika: Wire Solder, Muundo: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Kipenyo: 0.040" (1.02mm), Kiwango cha kuyeyuka: 423 ~ 424°F (217 ~ 218°C), Aina ya Flux: Water Soluble, Kupima waya: 18 AWG, 19 SWG,