Aina ya Bodi ya Proto: Connector to SIP, Kifurushi Kimekubaliwa: USB - micro B, Idadi ya Nafasi: 5, Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: MiniSOIC, Idadi ya Nafasi: 8, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: DFN, Idadi ya Nafasi: 6, Panda: 0.037" (0.95mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SOIC, Idadi ya Nafasi: 28, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: DFN, Idadi ya Nafasi: 12, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TQFP, VQFP, Idadi ya Nafasi: 100, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: PQFP, TQFP, Idadi ya Nafasi: 64, Panda: 0.031" (0.80mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SSOP, Idadi ya Nafasi: 16, Panda: 0.025" (0.64mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: PowerSOIC, PSOP, HSOP, Idadi ya Nafasi: 24, Panda: 0.039" (1.00mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: 0.5mm Connector, Idadi ya Nafasi: 20, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Plated Through Hole to Plated Through Hole, Idadi ya Nafasi: 16, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.063" (1.60mm), Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LQFP, PQFP, TQFP, VQFP, Idadi ya Nafasi: 44, Panda: 0.031" (0.80mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SSOP, Idadi ya Nafasi: 24, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: QFN, Idadi ya Nafasi: 20, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TSSOP, Idadi ya Nafasi: 28, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Connector to SIP, Kifurushi Kimekubaliwa: USB - A, Idadi ya Nafasi: 4, Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: FPC Connector, Idadi ya Nafasi: 50, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: QFN, Idadi ya Nafasi: 10, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LQFP, TQFP, Idadi ya Nafasi: 32, Panda: 0.031" (0.80mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: QFN THIN, Idadi ya Nafasi: 24, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Plated Through Hole to Plated Through Hole, Idadi ya Nafasi: 20, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.063" (1.60mm), Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LGA, Idadi ya Nafasi: 12, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: QFN, Idadi ya Nafasi: 32, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Connector to DIP, Kifurushi Kimekubaliwa: USB - C, Idadi ya Nafasi: 24, Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: QFN, Idadi ya Nafasi: 32, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TO-263 (DDPAK/D2PAK), Idadi ya Nafasi: 7, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to PGA, Kifurushi Kimekubaliwa: QFP, Idadi ya Nafasi: 48, 64, 80, 100, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: PowerSOIC, PSOP, HSOP, Idadi ya Nafasi: 20, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LCC, JLCC, PLCC, Idadi ya Nafasi: 44, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TO-263 (DDPAK/D2PAK), Idadi ya Nafasi: 5, Panda: 0.067" (1.70mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
