Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LQFP, Idadi ya Nafasi: 48, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LGA, Idadi ya Nafasi: 16, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SSOP, Idadi ya Nafasi: 28, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: FPC Connector, Idadi ya Nafasi: 25, Panda: 0.012" (0.30mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TSSOP, Idadi ya Nafasi: 38, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Plated Through Hole to Plated Through Hole, Idadi ya Nafasi: 10, Panda: 0.079" (2.00mm), 0.100" (2.54mm), Unene wa Bodi: 0.063" (1.60mm), Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: DFN, Idadi ya Nafasi: 10, Panda: 0.016" (0.40mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Connector to SIP, Kifurushi Kimekubaliwa: microSD™ Card, Idadi ya Nafasi: 10, Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Connector to DIP, Kifurushi Kimekubaliwa: 1.27mm Header, Idadi ya Nafasi: 10, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TSSOP, Idadi ya Nafasi: 56, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TSSOP, Idadi ya Nafasi: 48, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Plated Through Hole to Plated Through Hole, Idadi ya Nafasi: 4, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.063" (1.60mm), Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SC-70, SOT-353, Idadi ya Nafasi: 5, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SOP, Idadi ya Nafasi: 8, Panda: 0.100" (2.54mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Plated Through Hole to Plated Through Hole, Idadi ya Nafasi: 6, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.063" (1.60mm), Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: QFN, Idadi ya Nafasi: 20, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: FPC Connector, Idadi ya Nafasi: 45, Panda: 0.012" (0.30mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: FPC Connector, Idadi ya Nafasi: 20, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: QSOP, Idadi ya Nafasi: 24, Panda: 0.025" (0.64mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Plated Through Hole to Plated Through Hole, Idadi ya Nafasi: 8, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.063" (1.60mm), Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: FPC Connector, Idadi ya Nafasi: 40, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: MSOP, Idadi ya Nafasi: 8, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: 0.5mm Connector, Idadi ya Nafasi: 60, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: DFN, Idadi ya Nafasi: 8, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SOT-23, Idadi ya Nafasi: 5, Panda: 0.037" (0.95mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TSSOP, Idadi ya Nafasi: 28, Panda: 0.026" (0.65mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LGA, Idadi ya Nafasi: 14, Panda: 0.031" (0.80mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SOIC, Idadi ya Nafasi: 20, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: LQFP, TQFP, VQFP, Idadi ya Nafasi: 64, Panda: 0.020" (0.50mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: SOIC, Idadi ya Nafasi: 8, Panda: 0.050" (1.27mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: SMD to DIP, Kifurushi Kimekubaliwa: TO-263 (DDPAK/D2PAK), Idadi ya Nafasi: 3, Panda: 0.100" (2.54mm), Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
Aina ya Bodi ya Proto: Connector to SIP, Kifurushi Kimekubaliwa: DB9, Idadi ya Nafasi: 9, Unene wa Bodi: 0.062" (1.57mm) 1/16", Nyenzo: FR4 Epoxy Glass,
