Badilisha kutoka (Adapter End): TSOP, Badilisha hadi (Mwisho wa Adapter): DIP, Idadi ya Pini: 40, Lami - Kuoana: 0.020" (0.50mm), Aina ya Kuweka: Through Hole,
Badilisha kutoka (Adapter End): SOIC, Badilisha hadi (Mwisho wa Adapter): DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Pini: 40, Lami - Kuoana: 0.050" (1.27mm), Aina ya Kuweka: Through Hole,
Badilisha kutoka (Adapter End): TSOP, Badilisha hadi (Mwisho wa Adapter): DIP, Idadi ya Pini: 56, Lami - Kuoana: 0.020" (0.50mm), Aina ya Kuweka: Through Hole,
Badilisha kutoka (Adapter End): SOIC, Badilisha hadi (Mwisho wa Adapter): DIP, Idadi ya Pini: 44, Lami - Kuoana: 0.050" (1.27mm), Aina ya Kuweka: Through Hole,