Mtindo wa Kiunganishi: Receptacle with Cage, Aina ya Kiunganishi: SFP, Idadi ya Nafasi: 10, Aina ya Kuweka: Through Hole, Right Angle, Kukomesha: Solder,
Mtindo wa Kiunganishi: Receptacle with Cage, Aina ya Kiunganishi: QSFP, Idadi ya Nafasi: 38, Aina ya Kuweka: Through Hole, Right Angle, Kukomesha: Press-Fit, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle with Cage, Aina ya Kiunganishi: SFP, Idadi ya Nafasi: 20, Aina ya Kuweka: Through Hole, Right Angle, Kukomesha: Press-Fit, Vipengele: EMI Shielded,
Mtindo wa Kiunganishi: Receptacle with Cage, with Heat Sink, Aina ya Kiunganishi: QSFP, Idadi ya Nafasi: 38, Aina ya Kuweka: Through Hole, Right Angle, Kukomesha: Press-Fit, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: QSFP, Idadi ya Nafasi: 38, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: Multi-Purpose, Idadi ya Nafasi: 20, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide, EMI Shielded,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: High Density I/O, Idadi ya Nafasi: 140, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide, EMI Shielded,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: Multi-Purpose, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide, EMI Shielded,
Mtindo wa Kiunganishi: Receptacle with Cage, Aina ya Kiunganishi: SFP, Idadi ya Nafasi: 10, Aina ya Kuweka: Through Hole, Right Angle, Kukomesha: Solder,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: SFP+, Idadi ya Nafasi: 20, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: Micro Flyover, Idadi ya Nafasi: 19, Aina ya Kuweka: Surface Mount, Right Angle; Through Hole, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: Multi-Purpose, Idadi ya Nafasi: 30, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide, EMI Shielded,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: SFP+, Idadi ya Nafasi: 30, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: SFP+, Idadi ya Nafasi: 70, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: Micro Flyover, Idadi ya Nafasi: 10, Aina ya Kuweka: Surface Mount, Through Hole, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Cage with Heat Sink, Aina ya Kiunganishi: QSFP, Aina ya Kuweka: Through Hole, Right Angle, Kukomesha: Press-Fit, Vipengele: EMI Shielded,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: Multi-Purpose, Idadi ya Nafasi: 20, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide, EMI Shielded,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: SFP+, Idadi ya Nafasi: 20, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: SFP+, Idadi ya Nafasi: 20, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide,
Mtindo wa Kiunganishi: Receptacle, Aina ya Kiunganishi: Multi-Purpose, Idadi ya Nafasi: 10, Aina ya Kuweka: Surface Mount, Right Angle, Kukomesha: Solder, Vipengele: Board Guide, EMI Shielded,
